About TEPC

Founded : October,1995

Capital : USD19,000,000

Offer : Special Packages , Image Products

Target: To provide the best service to our customers

Locations: FOL+EOL1: Chu-Bei,Taiwan .

Focus: QUALITY/COST/SPEED

Company Milestones

2021 ----- Biochip package
2018 ----- PD + LED package
2016 ----- Multi-Chip Package for PD application
2014 ----- Mask on glass package for PD application
2013 ----- 3D sensor application
2012 ----- Mass production PD package
2010 ----- Developed PD application
2008 ----- tLCC 2~3 Mega CCM for NB & Developing high power LED
2004 ----- Delivered over 12 million VGA CCM to tier 1 customers.
2003 ----- Mass production of the tLCC Compact Camera Module (CCM)
2002 ----- Mass production of the tLCC image sensor
1999 ----- Mass produced CLCC COMOS image sensor packaging
1998 ----- Developed 1st CMOS image sensor packaging in Taiwan & ISO9001
1995 ----- TEPC established